SANTA CLARA, Calif., Aug. 31, 2012 – Agilent Technologies Inc. (NYSE: A) today announced its 2012 High-Speed Digital Tour, covering more than 50 locations throughout Europe.
High-speed digital design challenges are growing at an incredible rate, especially in applications using higher performance data interconnects. In these applications signal integrity effects dominate, and reference and legacy designs no longer work, forcing engineering teams to predict and account for high-frequency effects.
This new environment requires high-quality measurement tools, probes and fixtures, as well as a robust methodology and common viewpoint with correlation between measurement and simulation teams. Agilent is well equipped to help digital engineers address these challenges head on. The company offers a complete high-speed digital solution, including design tools, measurement and protocol analyzers.
The no-cost seminar, taught by Agilent experts and encapsulating Agilent’s expertise in the high-speed digital arena, will show attendees how they can successfully navigate through today’s high-speed technology challenges—from early design to prototype validation—while ensuring compliant designs. Attendees will also learn about signal integrity challenges in high-speed digital links and how those effects can be anticipated and reduced. Demonstrations of Agilent instruments will be made available during the seminar.
Xilinx, the world’s leading provider of all-programmable FPGAs, SoCs and 3-D ICs, will join the tour to address FPGA-specific signal integrity challenges and solutions. Xilinx will also explain how its 7 series FPGAs can deliver a record aggregate bandwidth of up to 2.78 Tb/s and the industry’s best serial signal integrity at up to 28.05Gbps. This offering, coupled with Agilent’s own high-speed digital solution, provides digital designers with a complete solution for FPGA modeling, debugging and integration.
“We are very pleased to work with Xilinx on our 2012 high-speed digital seminar tour,” said Shamree Howard, high-speed digital program manager for Agilent. “Agilent and Xilinx have collaborated for several years now and we share a common viewpoint with a robust methodology set up that includes IBIS AMI model generation. I am confident that the overall seminar content will help our mutual customers meet their design expectations.”
“Designers are looking for powerful FPGAs and associated tools to meet their multigigabit challenges,” said Giles Peckham, European marketing director for Xilinx. “Agilent uniquely offers a complete integrated and correlated flow solution spanning design, board characterization, signal capture, protocol analysis, stress analysis and automated compliance verification. Working together, our solutions can play a critical role in allowing today’s digital designers to overcome the challenges they face.”
For more information on Agilent’s 2012 High-Speed Digital Tour or to register online, go to www.agilent.com/find/hsd-emea-2012.