UK Strengths, Capabilities & Gaps

10.05am – 11.10am, 8 July 2026 ‐ 1 hour 5 mins

Speaker Session

As the semiconductor industry looks to move beyond the current AI wave, this session assesses the UK’s current position in the globally competitive semiconductor ecosystem: our strengths, our gaps, and the opportunities that lie ahead. With a focus on what comes next - from photonics and power electronics to heterogenous integration - we will explore how the UK can shape and lead in the next frontier of technology.

Tony Pearce, COO, Paragraf
Commercialising Next-Generation Electronics in the UK Through Advanced Materials and Manufacturing
Paragraf has opened the world's first graphene foundry in here in the UK. The six-inch graphene-on-silicon wafers produced at our Huntingdon manufacturing facility enable next-generation electronics that are already exploring solutions in quantum computing, healthcare, AI and more. Achieving the transition from research to manufacturing demonstrates genuine strengths of the UK deep-tech ecosystem. A huge opportunity exists to further exploit our leadership position in advanced 2D materials, placing the UK at the core of material solutions which directly address the industry’s biggest challenges in energy efficiency, connectivity and compute.

Haydn Povey, CEO, SCI Semiconductors
CHERI - A New Paradigm for Resilient Control and Compute
This talk introduces CHERI, a new hardware/software paradigm designed to improve system resilience by addressing fundamental memory safety vulnerabilities and enabling secure compartmentalisation. It will explore key applications and how governments are supporting adoption to strengthen critical infrastructure and next-generation compute systems.

John Boston, Managing Director, Custom Interconnect Ltd
Medium Volume Production and Advanced Packaging in the UK
The UK or in fact Europe cannot compete with the Far East / China for high volume advanced semiconductor packaging. However, there are multiple applications whereby annual quantities are much smaller, but still complex semiconductor packaging is required. This presentation will cover annual quantities ranging from 10off – 1,000,000 off per annum with advanced packaging covering 3D Heterogenous integration, RF devices, wafer bumping for medical devices, SiC & GaN power device packaging and high Cu wirebond count devices for AI processor manufacture. All these technologies are being developed and manufactured in the UK with European OEM and chip start partners.