RFMOD's IP and packaging technologies target high volume, size /cost critical markets such as mobile phones, ”Smart-power”, "Wearables" and together with software, the "Internet of Things"

In early 2015 RFMOD launched a "Semiconductor Package Design Service" to support companies with the successful co-design of chips and package through, stages of prototype, manufacture and new product introduction.

RFMOD Invents, develops and licences enabling technologies that deliver disruptive products with unprecedented levels of functionality, performance, value and small size. RFMOD mantra is to "Design-for-market".

At RFMOD, manufacturing knowledge is aligned with best practice to provide optimised solutions characterised by clearly targeted performance, reduced Bill-of-Materials (BoM), simplified PCB and SMT assembly. Customers directly benefit from a simplified build and lowest cost-of-ownership. RFMOD has over 25 years experience in the design of WLCSP, QFN, Flip-Chip, BGA and MEMS

To benefit from RFMOD technology and design expertise visit www.rfmod.com