This IMAPS organised Conference combines invited Keynotes, Presentations and Posters from leading Industrial Companies, Academics and Research Institutions developing sensors, semiconductors, components, energy sources, packaging and assemblies that must perform reliably under extreme conditions, including high and low temperatures, high field strengths, severe mechanical and environmental conditions and ultra-long life electronics. This Conference follows on from and extends the High Temperature Electronics Network (HITEN).

This Conference will provide examples of the implementation of electronics packaging in challenging applications, where electronics and sensors must improve the control of energy intensive processes, ensure safety in hostile industrial environments, work reliably in extreme natural conditions and provide security in critical applications.

The Conference will take place at Churchill College, Cambridge, CB3 0DS.