To Chiplet or Not to Chiplet

Opportunities, challenges and the UK’s role in the next generation of semiconductor integration.

Chiplets have dominated discussions about product roadmaps in the semiconductor sector for several years already.  Viewed as an enabler of new business models, combining aspects of both the Fabless and Design IP approaches, Chiplets have the potential to deliver much richer roadmap combinations with much less re-design effort.  Having been restricted in the early days to single-vendor solutions, the building blocks are now in place for the heterogeneous opportunities combining Chiplets from multiple vendors and multiple process technologies.

This event will look at the current state of the Chiplet landscape, helping delegates understand the challenges and opportunities of this new approach to semiconductor product delivery and the role the UK will play in that.  We will explore the technical differences between Chiplets and previous approaches such as MCM and die stacking, practical issues involving power, thermal management, interconnect and packaging including integration of photonics, and the new commercial opportunities and business models that are enabled by Chiplets.  We will also consider the remaining obstacles to deployment, and how they can be overcome.

Thank you for our Semiconductor SIG sponsor Marks & Clerk
BD42-Marks_and_Clerk.png

Semiconductor SIG Champions

Dr. Maheera Abdul Ghani

Materials Scientist and Postdoctoral Researcher , Department of Materials Science and Metallurgy, University of Cambridge

Rachel Boyd-Moss

Rachel Boyd-Moss

Director, Clause & Effect

Russell Haggar

Russell Haggar

Managing Director - ChipStart UK, Silicon Catalyst.UK

Stephen Riches

Stephen Riches

Director, Tribus-D Ltd

Steve Taylor

Steve Taylor

Director of Strategic Marketing, UK Semiconductor Centre

Hashem ZareHoseini

Hashem ZareHoseini

Head of UK mmWave Chip Design. Deputy Technical Director/Visiting Professor, MediaTek/ King's College London