Chip Packaging Engineer


At Zero Point Motion we are redefining inertial sensors to enable high precision
positioning and navigation. Our mission is to provide exquisitely low-noise readout of acceleration
and rotation using cavity opto-mechanics in a hybrid MEMS/photonic chip.

We’re a start-up commercialising technology invented by the CEO, Dr Lia Li, and with a founding team including semiconductor veterans, we operate a VC-funded, fabless business.

We're seeking enthusiastic engineers to join our team and shape our technology
design, strategy, and workflow. Together we will bring aerospace/defence levels of sensor
performance to commercial mass markets to transform indoor, autonomous and GNSS-denied
navigation. Can you help us disrupt the inertial sensing market?

Role Overview

We are looking for a packaging engineer with experience in die-to-die and waferscale bonding for MEMS and/or PICs (e.g. LIDAR, optical switches, pressure sensors, inertial sensors, oscillators). You will draw upon your hands-on experience to support development of our MEMS/PIC – as a fabless company we do not require any experimental work or process development in-house, although occasional opportunities may arise with our partners. Our collaborative culture of knowledge exchange means no prior experience in inertial sensors is required, just your enthusiasm to learn. You will be responsible for de-risking the integration and packaging of new inertial sensors for high volume commercial applications. Your expertise in packaging processes will influence key discussions with R&D facilities, foundries and packaging houses, with focus on maintaining high performance post chip bonding and packaging in target markets such as automotive. You will be part of our core technical team working with an experienced group of electronic engineers, physicists, chip designers and hardware engineers in a fast-paced environment that requires self-motivation and a willingness to embrace new ideas. We want dynamic people that understand the scale and nature of our goal, who can challenge our assumptions. This is an exciting opportunity for a packaging engineer to move out of hands-on work and into strategy.


Competitive salary

Generous company package including share options, pension, and sick pay

Flexible working arrangements with potential for remote working

Location & Travel

Zero Point Motion’s office and lab space is located in the Bristol University Quantum Technology Innovation Center amongst likeminded start-up companies. There will be a requirement for regular travel to Bristol (if working remotely) and occasional travel throughout the UK and abroad for conferences, meetings and engineering visits.

Office address

Bristol University Quantum Technology Innovation Center
1 Cathedral Square

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